Thin Wall Packaging 2018
The 7th AMI international conference on thin wall packaging will take place on March 20-21, 2018 at The Westin Chicago North Shore in Chicago, IL, USA.
Thin Wall Packaging 2018 offers a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging.
Verstraete’s Sales Manager North America, Peter Paelinck, will inspire you with his presentation 'IML packaging, a universe of possibilities' on Wednesday March 21st.
He will be present to answer all your IML related questions. He is intimately familiar with the large majority of installed (and planned) IML systems in the US and Canada. He has attended many TWP editions in the past and states: "Thin Wall Packaging is a great conference that allows you to "think outside the box" by being confronted with different industry segments each with their own subtleties. I like the fact that the conference is not jam-packed, allowing lots of opportunity for industry networking".
Looking forward to meeting you in Chicago!