Thin Wall Packaging

Thin Wall Packaging 2019 offers a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging. It is also a great platform to have a full overview of the available technology, product and services thanks to the busy exhibition area. The two-day event (June 18-19) will take place at The Westin Chicago North Shore, Chicago, United States. Nico Van de Walle, Product & Circular Economy Manager at Verstraete IML, will inspire you with his presentation ‘Circular economy proof IML labels – the road towards 2030’.

June 18-19, 2019
Chicago, United States

Would you like a meeting with an IML specialist at this exhibition? Register here: